ECRIM participated the 2019 CIOE in ShenZhen
From Sep.4th to 7th 2019, Ecrim participated the 21 th CIOE in ShenZhen ,China. Our Booth No. is 1029/1030 .
During the Exhibition, we will show our key products such as Metal-Ceramic Integrated Packages,Modulator/Pumplaser/Infrated detector/ packages and Metallized Substrate,HTCC/LTCC Substrate ,Ceramic Component.Also we have Power heat sink, Microwave Submount /Chip component for diversified market ,particularly meet optical communication market requirements. Welcome to come our booth for exchange and cooperation.
CIOE (China International Optoelectronic Exposition) is the world's leading exhibition in optoelectronic and photonic industry. The event presents the entire supply chain. Nearly 2,000+ photonic players will display their cutting-edge products and technologies at CIOE 2019. It is one ideal platform to find new suppliers, to source for new products, to exchange technical thoughts and to discover more market opportunities. In addition, onsite activities such as new products and new technology presentation, VIP buyer match-making, VIP lounge will provide you more efficient visiting services.
ECRIM develops ,manufactures and markets high reliable price competitive products for microelectronic industry. its main products include hybrid integrated circuits modules (DC-DC converters& EMI Filters, synchro/resolver to digital converters., etc), hermetically sealed metal packages, belt furnaces, LTCC/HTCC/AlN/Thick/thin-film OEM service. ECRIM provides satisfied service to global customers in North America, EU, Asia ,Australia. Its mission to be the leading role in the microelectronics & packaging industry. For more information , visit http://www.ecrim.cn
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