ECRI Microelectronics

ECRIM will participate in The IDEF 2019

    ECRIM will participate inIDEF 2019,which will be held on between April 30 - May 3, 2019 at TÜYAP Fair and Congress Center in Büyükçekmece, Istanbul. In the exhibition, ECRIM will show lots of products there and our booth is located at 1442A.

    IDEF 2019 began in 1993 and is a professional exhibition of Turkish highest specifications, which is held every two years. Over the years, it has received strong support from more than a dozen government departments in Turkey. In addition, there are many associations, chambers of commerce, media, and industry giants with strong support, rapid growth and remarkable results. The exhibition is divided into seven sections: land, sea, air, homeland security, space security, transportation and logistics support, and police equipment. The number of exhibitors last year was 820 which were from Russia, France, South Africa, China, Austria, Kazakhstan, Germany.There were 65,782 professional visitors from 116 countries and regions. The 20 defense ministers attended and 133 VIP delegations came from 61 countries. Several seminars and summit forums were held during the same period.

    IDEF 2019 has a full range of exhibiting products and services, and is a leader in the electronics industry. The most attractive factors is that exhibitions come from all over the world. It provides viewers with more opportunities to understand product and technology trends, while providing opportunities for companies to promote and release products.

About ECRIM
    ECRIM develops, manufactures and markets high reliable price competitive products for microelectronic industry.  Its main products include hybrid integrated circuits modules (DC/DC converters& EMI Filters, synchro/resolver to digital converters, etc), hermetically sealed metal packages, belt furnaces, LTCC/HTCC/AlN/Thick/thin-film OEM service. ECRIM provides satisfied service to global customers in North America, EU, Asia, and Australia. Its mission is to be the leading role in the microelectronics & packaging industry. For more informations, please visit http://www.ecrimpower.com

ECRIM
19 Hehuan Road, Hefei Hi-tech Zone, Hefei, Anhui,China 230088
Tel:+86-551-63667943    Fax:+86-551-65743191    E-mail:sales@ecrim.cn

Relate News
  • ECRIM won FINISAR's outstanding contribution award

    ECRIM won FINISAR's outstanding contribution award

    January 4, 2018​ECRIM with positive import market for many years, the advanced talent and technical support, high quality products and good services, received recognition by the FINISAR company, especially for the key research projects in nearly three years overcome diview
  • The 50th anniversary celebration in ECRIM

    The 50th anniversary celebration in ECRIM

    March 22, 2018On March 15th 2018, a celebration of the corporate culture called “original aspiration and mission” ceremoniously showed among people’s expect. All programs in the celebration were edited and desig...view
  • ECRIM will participate in The Electronica 2018

    ECRIM will participate in The Electronica 2018

    September 30, 2018ECRIM will participate in Electronica 2018, which will be held from Nov. 13rd to Nov. 16th at the New Munich Trade Fair Centre in Munich, Germany. In the exhibition, ECRIM will show lots of products t...view
  • ECRIM participated the 2017 EXPO Eletronica Exhibition in Russia

    ECRIM participated the 2017 EXPO Eletronica Exhibition in Russia

    August 29, 2017ECRIM showed Space DC-DC converters, Aerospace/ military DC to DC converters、high-reliability thick film DC DC converters for defense market ,Synchro/Resolver to digital converters in the 2017 EXPO Eletronica Exhibitionview
  • A thankful letter from Finisar

    A thankful letter from Finisar

    March 8, 2018As the ECRIM’s 50th anniversary year coming soon, we received a thankful letter from Finisar, a global technology leader in optical communications. It is our great pleasure to work with Finisar. We h...view
  • The call for papers

    The call for papers

    April 12, 2018The call for papers of 20th national academic annual conference of hybrid integrated circuits and the international symposium on SIP (system-level package)view