ECRIM precision thick film technology pushes thick film ceramics to a best-in-class position from which we can meet or exceed thin film tolerances, and at a far more affordable price point.
FLEXIBILITY MULTI-LAYER INTEGRATION
Theprocess can be combined with standard thick film technology to create highly integrated multi-layer circuits, offering a more cost-effective solution and improves overall substrate yield.
DESIGN AND MATERIAL FLEXIBILITY
Ground plane metallization: Au, Pd/Au, Ag/Pd, Ag
Photo-imaged and etched conductors and RF circuits: Au
Dielectric and photo-imaged dielectric
Mixed-metal multi-layer circuits
Standard thick-film substrates: 96%, 99.5% and 99.6% alumina, aluminum nitride and BeO, quartz and fused silica, and ferrites.