The multilayer wiring ceramic substrate is welded together with one or more of the metal parts such as the metal shell, the metal sealing ring frame, the metal bottom plate and the connector to form a ceramic and metal integrated packaging structure with certain air tightness.This structure makes the substrate not only as a multi-layer circuit interconnection substrate, but also as a part of the packaging structure, after welding the cover plate, the multi-layer circuit airtight packaging can be realized.
Several Typical Integrated Packaging Products
1. Product Features
High integration, small size, light weight and high reliability.
2. Technical Index
Shell material: Al, Si, Kovar, Ti alloy
Air tightness: ≤ 1 × 10-3 Pa · cm3/s
Weld void ratio: ≤ 15%
Insulation resistance: ≥ 1010 Ω(500 VDC)
VSWR: ≤ 1.3
3. Typical Product
Microwave RF module (TR, up and down converter, transceiver channel);High-density integrated components (SIP circuits);Optical communication components, etc.
4. Application Domain
Microwave radio frequency, electronic countermeasure, optical communication, power device, computer
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