ECRI Microelectronics

HOL100S Series Thick Film DC-DC Converters

1. Features of HOL100S Series Thick Film DC-DC Converters

High reliability features
Width input voltage range:68V~110V,typical DC input voltage 100V
Output power PO:120W~150W
Operating temperature range Tc:-55℃~+125℃
Low Start-up current
No output overshoot
Inhibit function
under-voltage and over-voltage lock
Output short circuit and over-current protection
Output voltage fine tunable
Output sensing function
Maximum power density:100W/in3
Efficiency 91%
Hermetically sealed metal cases


2. Scope of application of HOL100S Series Thick Film DC DC Converters

High-reliability electronic system for aviation and aerospace, weapon and ships etc


3. Description of HOL100S Series Thick Film DC to DC Converters

This series products are high reliable hybrid thick film large power DC-DC converter. By using push-pull circuit topology and pulse width modulation principle, the output sampling voltage isolated by optocoupler to modulate the pulse width and form the closed-loop control to make the product a stable voltage output. This series products are made by thick film hybrid integrated process, hermetically sealed metal cases. Product design and manufacturing meets MIL-PRF-38534 requirements. Customers can connect the matching power EMI filters in the input port to improve the product’s electromagnetic compatibility.


4. Electrical performance of HOL100S Series Thick Film DC-DC Converter


Tabel2 Rated conditions and recommended operating conditions

Absolute Max. Rated value

Output voltage:67V~112V

Output power:150W

Storage temperature:-65℃~150℃

Mechanical Shock:1500g

Lead resistance to welding temperature:300℃(15s)

Weight:100g

ESD:2000V


表3电特性

No.

Parameter

Conditions

(Unless other wise,-55℃≤Tc≤125℃,VIN=28V±5%)

HOL100S5

HOL100S12

HOL100S28

Min

Max

Min

Max

Min

Max

1

Input voltage/V

Low、High、Ambient Temperature

68

110

68

110

68

110

2

Output voltage/V

Full load

Ambient

4.95

5.05

11.88

12.12

27.72

28.28

Low/high

4.95

5.05

11.88

12.12

27.50

28.50

3

Output current/A

VIN=16V~40V

-

24

-

10.9

-

5.3

4

Output Power/W


-

120

-

130

-

150

5

Output Ripple Voltage/mV

BW≤20MHz,Full load

-

100

-

100

-

280

6

Line Regulation/mV

VIN=16V~40V,Full load

-

50

-

120

-

280

7

Load Regulation/mV

No load to full

-

50

-

120

-

280

8

Input current/mA

Inhibited

-

10

-

10

-

10

Io=no load

-

80

-

80

-

50

9

Input Ripple current/mA

BW≤20MHz,Full load

-

-

-

-

-

-

10

Efficiency/%

Full load

Ambient

87

-

90

-

88

-

Low/high

85

-

88

-

86

-

11

Isolation/MΩ

Input to output or any pin to case at 500V,Tc=25℃

100

-

100

-

100

-

12

Inhibit voltage


-

0.8

-

0.8

-

0.8

13

Inhibit open circuit voltage/V

Full load

9

14

9

14

9

14

14

Under voltage turn-on voltage/V

Full load

63

68

63

68

63

68

15

Under voltage cut-off voltage/V

Full load

60

65

60

65

60

65

16

Short Circuit Protection power consumption

Full load

-

35

-

35

-

35

17

Capacitive

load/μF

Tc=25℃

-

1000

-

1000

-

1000

18

Switching frequency/kHz

Full load

250

350

250

350

250

350

19

Step Load Response Transient(mV pK)

50%load→full load or Full load →50% load

-

500

-

600

-

1400

20

Step Load Response Recovery(μs)

50%load→full load or Full load →50% load

-

500

-

600

-

1000

21

Step Line Response Transient(mV pK)

VIN:16V→40V,

VIN:40V→16V,Io=Full load

-

-

-

-

-

-

22

Step Line Response Recovery(μs)

VIN:16V→40V,

VIN:40V→16V,Io=Full load

-

-

-

-

-

-

23

Start-up Overshoot(mV pK)

VIN:0→28V,

Io=Full load

-

50

-

120

-

280

24

Start-up Delay (ms)

VIN:0→28V,

Io=Full load

-

20

-

20

-

20


5. Circuit block diagram of HOL100S Series Thick Film DC-DC Converters


Fig 1 HOL100S Series circuit block diagram
Fig 1 HOL100S Series circuit block diagram


6. Typical Performance Curves (Testing condition as per Tc=25℃,VIN=100V±5%, Full load, unless otherwise specified)


Fig 2 HOL100S9R5 Efficiency curves
Fig 2 HOL100S9R5 Efficiency curves

Fig 3 HOL100S9R5 Step Load Response

Fig 3 HOL100S9R5 Step Load Response

Fig 4 HOL100S9R5 Start-up Overshoot/Start-up Delay
Fig 4 HOL100S9R5 Start-up Overshoot/Start-up Delay

7. MTBF Curves of HOL100S Series Thick Film DC DC Converters


Fig 5 MTBF Temperature Curves(HOL100S9R5) (Well ground condition)
Fig 5  MTBF Temperature Curves(HOL100S9R5)

(Well ground condition)

8. Pin Designations of HOL100S Series Thick Film DC to DC Converters



Fig 6 Pin Out Bottom View

Pin Designation

Pin

Symbol

Designation

Pin

Symbol

Designation

1

VI

Positive input

7

Vo

Output

2

GNDI

Input ground

8

GNDO

Output ground

3

TRIM

Trimming

9

SEN-

Negative output sensing

4

INH1

Primary Inhibit

10

SEN+

Positive output sensing

5

NC

NC

11

NC

NC

6

NC

NC

12

NC

NC


9. Typical Connection Diagram of HOL100S Series Thick Film DC-DC Converters


Fig 7 Products Using Connection Diagram
Fig 7 Products Using Connection Diagram


Fig 8 EMI Filter Connection Diagram
Fig 8  EMI Filter Connection Diagram


10. Package Specifications of HOL100S Series Thick Film DC to DC Converters


fig-9-bottom-view
Fig 9 Bottom View


Table 4  Package Outline

Dimension Symbols

Unit/mm

Minimum

Nominal

Maximum

A

-

-

10.66

A1

5.29


5.89

φb

0.87


1.13

D

-

-

76.70

E

-

-

38.60

e

-

5.08

-

L

5.35

-

-

φP

3.00

-

3.60

X1

69.90

70.1

70.3

X2

-

-

64.00

Y1

31.80

32

32.20

Notes: e is interchangeable size, made by the shell manufacturing and inspection, this specification does not do the assessment requirements.

Table 5  Case Materials

Case Model

Header

Header Plating

Cover

Cover Plating

Pin

Pin Plating

Sealing Style

Notes

fpp6438-12d

Cold Rolled Steel(10#)

Dau-2/Ni4Au1.0

Kovar

(4J42)

Ni

Oxygen-free copper


Parallel seam welding


11. Ordering Information of HOL100S Series Thick Film DC DC Converters



Fig 10 Part Numbering Key
Fig 10  Part Numbering Key

Applications Notes:


  • Both positive and negative terminals for power supply shall be correctly connected when power is applied so as to avoid permanent damage to the device.
  • Testing position shall be the root of the pin of the device when the electrical characteristic is measured.
  • The baseplate of the device shall be closely attached to the circuit board during device mounting so as to avoid the damage on pins. The shockproof actions shall be adopted when necessary.
  • Pins shall not be bended to avoid the glass insulator cracking and case leaking.
  • Pins at inhibit terminal shall be hung in the air during no operation.
  • When ordering this device,the detail electrical specification shall be based on relevant standards. While data offered in this document shall be for reference only.




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