ECRI Microelectronics

Low Temperature Co-fired Ceramic (LTCC)

Low Temperature Co-fired Ceramic (LTCC) ECRIM has an advanced LTCC production line, using low temperature co-fired ceramic (LTCC) technology to provide customers with high-performance LTCC components, substrates, integrated package components to meet the needs of different customers. We can provide SIP packages for high-performance and high-density microwave devices. Our products are widely used in communication, microwave, automotive, radar and other electronic systems, as well as bluetooth, antenna modules, power amplifiers, filter components, duplexer switches and other applications.

Application of LTCC Substrate

Electronic equipment systems such as aerospace, aviation, ships, weapons, and electronic systems.


LTCC process technical indicators:
  • Line width/pitch: 75μm
  • Line precision: ≤±10μm
  • Warpage: <3mil/in
  • Embedded components: Resistance, capacitance, inductance
  • Top layers: 40 layers
  • Substrate size: 125mm×125mm
  • Inspection standard: GJB2438A, GJB548A

Design specification



(A)Through hole diameter

0.15, 0.20,0.25,0.30

0.10 (min)

(B)Through hole cover disk diameter

>=Through hole + 0.05

Via + 0.03

(C) Through hole pitch

>=2.5 times through hole diameter

0.20 (for0.10 Through hole)

(D) Distancefrom through hole to line edge



(E) Line width

>= 0.15

>= 0.075

(F)  Line pitch

>= 0.10

>= 0.08

(G)Line center distance

>= 0.25

>= 0.16

(H) Distancefrom hole center to substrate edge

>= 0.30

>= 0.25

(I) Distance from line to substrate edge

>= 0.20

>= 0.15

(J)Distanceof inner layer tunnel substrate edge

>= 0.15

>= 0.10

(K)Distanceof through hole to ground


>= 0.15

Substrate thickness

0.5 to2.0

0.4 to4.0

Substrate layers




LTCC microwave passive component
1.Work frequency: 1.0~10GHz
2.Small volume, customizable design.
3.Low insertion loss (≤3dB)
4.Surface mount structure, 50Ω impedance matching, stable electrical performance
5.Temperature: -55℃~+85℃


Microwave/millimeter wave LTCC substrate
1.Work frequency: 1.0~40GHz
2.Integrated package structure
3.Low insertion loss (≤0.2dB/cm)
4.Customizable into multi-cavity structure
5.Embedded passive components (Resistance, capacitance, inductance)

Hybrid circuit LTCC substrate and integrated package
1. Metal/integrated hermetic package structure
2. wiring layers  5-40 layers
3. Embedded passive components
4. Temperature (TC): -55℃~+125℃

LTCC 3D SIP package module
1. Three-dimensional vertical interconnection
2. BGA   I/O
3. 4 layers 2D-MCM laminates
4. Temperature (TC):-55℃~+125℃

RF Microwave Filter
RF Microwave Filter Max. Output Power (W) Input DC Voltage (V) Output Voltage (V)