ECRI Microelectronics

LTCC Technology

LTCC Design guide


1. Design Specification

Index

Typical Index

Development Index

Diameter of through-hole covering area E (μ m)

250

150

Line hole spacing C (μ m)

250

150

Conductor spacing B (μ m)

150

75

Conductor line width A (μ m)

150

75

Distance D (μ m) from the edge of the surface conductor to the edge of the substrate

300

200

Surface layer RF microstrip, stripline distance from edge of substrate (mu m)

200

100

Distance from the edge of the inner conductor to the edge of the substrate (mu m)

300

200

Line width accuracy of top conductor (μ m)

± 15 μm (high precision ± 10 μm)

INTERNAL CONDUCTOR LINE TOLERANCE DIFFERENCE

± 20 μm (high precision ± 10 μm)

Number of substrate layers

6-34 FLOOR

Bottom remaining layer

4-storey

Cavity Wall Distance

2.0mm


2. Material Selection

Nature

DP951

Ferro-A6M

DP9K7

Thickness of raw porcelain tape (μ m)

951C2:50

951PT:114

951P2:165

127

127

Sintered layer thickness (mm)

951C2:42

951PT:0.095

0.096

0.112

Sintering shrinkage (X, Y)

12.7 ± 0.3%

15.5 ± 0.3%

9.1 ± 0.3%

Sintering shrinkage (Z)

15 ± 0.5%

25 ± 0.3%

11.8 ± 0.5%

Dielectric constant

7.8(3GHz)

5.9 (1-100 GHz)

7.10(10GHz)

DIELECTRIC LOSS

0.006(3G Hz)

0.002 (1-100GHz)

0.0009(10GHz)

Insulation Resistance

> 1012 Ω (100 VDC)

> 10 14 Ω (100 VDC)

> 1012 Ω (100 VDC)

Breakdown Voltage

> 1000 V/25 μm

> 1000 V/25 μm

> 1100 V/25 μm

Thermal conductivity (W/mk)

3.3

2

4.6

Coefficient of thermal expansion (ppm/℃)

5.8

7

4.4

Sintering density (G/cm3)

3.1

2.45

3.1

Flexural strength (MPa)

320

170

230


3. METALLIZATION SELECTION

Conductor Property

DuPont 951

MATERIAL SYSTEM

Ferro A6M

MATERIAL SYSTEM

DuPont 9K7

MATERIAL SYSTEM

Conductor type

Inner layer Ag, Au

Outer layer Ag, Au, PdAg, PtAu

Inner layer Ag, Au

Outer layer Ag, Au, PtPdAu

Inner layer Ag, Au

Outer layer Ag, Au, PdAg, PtAu

Thickness of outer conductor film (μ m)

10 ± 3

10 ± 3

10 ± 3

Thickness of inner conductor film (μ m)

6-12

6-12

6-12

Outer conductor square resistance mΩ

(Film thickness 10 μm)

Au < 5

Ag < 4

AgPd < 40

Au < 5

Ag < 4

PtPdAu < 40

Au < 5

Ag < 4

PtPdAu < 40

INNER-LAYER CONDUCTOR SQUARE RESISTANCE

(Film thickness 10 μm)

Au < 5

Ag < 4

Au < 5

Ag < 4

Au < 5

Ag < 4


Manufacturing capacity: LTCC manufacturing equipment and testing instruments with international advanced level are introduced, with a dust-free purification workshop of 3000 M2 and 100000 class, with an annual output of 20000 ceramic plates of 150 mm X 150 mm area.

LTCC  Technology
Model Series Max. Output Power (W) Input DC Voltage (V) Output Voltage (V)