Thick film ceramic substrate
The passive network is fabricated on the same substrate by screen printing and sintered thick film process, which has the advantages of high flexibility in circuit design, short development and production cycle, and is suitable for batch production.In terms of electrical performance, it can withstand higher voltage, greater power and greater current.
Front and back metallization, can punch metallization, can realize chip bonding, device bonding and welding functions.
MATERIALS: AlN, AI2O3
Line width/line spacing: 75um
Metallization: Au, Pd/Ag, Ag, Cu
DC/DC circuit substrate, high-power device substrate, communication base station substrate, power resistor, attenuator
Widely used in aerospace, computers, automobiles, communications, instrumentation, power, consumer and other electronic products.