ECRI Microelectronics

Thin film microwave substrate

  • 1. Overview
The main matrix material of the film microwave substrate is alumina ceramics. We can provide customers with customized services, such as aluminum nitride base and quartz base microwave base plate processing.


2. Process description

Film system

Typical floor resistance

50-75-100Ω/□

Typical thickness of transition layer

1000~3000Å

Surface metal thickness

3~8μm

Lithography

Resolution ratio

0.8μm

Registration accuracy

±1μm

Double exposure, thick adhesive exposure

Scribing

Minimum cut size

0.5mm×0.5mm

Dimensional accuracy

±50μm

Unit alignment accuracy

±5μm

Process capability

The 2″×2″ substrate can produce 800 pieces/week

Thin film microwave substrate
Model Series Max. Output Power (W) Input DC Voltage (V) Output Voltage (V)