ECRI Microelectronics

Influences of Hot-pressed Sintering Technology on LTCC Substrate Shrinkage Consistent

Abstract: The shrinkage of LTCC substrate is very important, which affects the performance of the product and post assembly. According to the research and analysis of the actual production process and related process, it is found that the hot pressing parameters and sintering technology are the key factors to affect the shrinkage. Based on this, a lot of experiments have been done to study the relationship between hot pressing parameters and shrinkage. According to ununiformity temperature of sintering nace, sintering space can be changed reasonably, the temperature variation of sintering position is recorded, the sintering rule of production is found out, so as to control the sintering shrinkage of LTCC substrate

Key Words: LTCC, hot pressing, sintering technology, shrinkage

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