ECRI Microelectronics

LTCC Substrate On-off Failure Mechanism Analysis

Abstract: This paper introduces two modes of typical LTCC substrate failure: short circuit and open circuit, the failure mechanism and countermeasures are analyzed and discussed, the basic reason of failure is also explored. From the perspective of layout design and material selection, the solution is developed. The reliability of the sintering experiment and environmental experiment verification scheme is used to completely solve the problem of unsatisfactory continuity caused by silver diffusion and void de - lamination between layers, and can provide LTCC certainly guidance and help for t layout design.

Key words: short circuit, open circuit, layout design, silver diffusion, de - lamination

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