ECRI Microelectronics

Research on LTCC Integral Substrate Packaging Process

Abstract: In this paper, the LTCC integral packaging process is introduced, focusing on parameters influence of packaging hermetic and welding void rate are studied. The research results show that integral packaging hermetic and void rate are mainly in-fluenced by packaging structure design, surface contamination and brazing pressure Based on the above parameters adjustment, finally the high hermetic and low void rate of integral packaging products are obtained

Key Words: LTCC, integral packaging, hermetic, void rate

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