ECRI Microelectronics

Technical Capabilities

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Technical Capabilities

Whether you need a custom power module, a DC-DC converter mini-mod, or a full scale power system, ECRIM offers a breadth of technical capabilities.

Electrical Design
Power system design Custom DC-DC circuit design
Custom AC-DC circuit design
Telemetry control circuitry
Power management
Thermal management
Radiation/survivability management
Analysis services such as Worst Case Analysis, Thermal Analysis, Radiation  Survivability Analysis, etc.

Mechanical Design
Custom or semi-custom power system design and assembly
3D modeling and photo rendering
Breadboard design
Prototyping
Enclosure design
Interconnects design

Packaging
Open frame or enclosures suited for the most rugged environments, including space
6 sided metal hermetic packages
6 sided metal non hermetic packages
Conduction cooled VME cards
Rack mounted asemblies

Assembly
Engineering unit assembly
Production assembly utilizing
Through-hole assembly
Surface mount assembly
Thick-film hybrid assembly
Available component level traceability

Quality and Test
Qualification and screening of hybrid modules to MIL-PRF-38534 Class H and Class K
ISO-9001-2000
GJB9001A-2001
Shock
Vibration
Temperature cycling
Stabilization bake
Constant Acceleration
Burn-in
PIND
Final electrical
Hermeticity
Radiography
Internal and external visual
Internal gas analysis
Life test
Bond pull and component shear
Resistance to soldering heat
ESD
Compliance assurance to customer requirements

Program Management
Programs managed by top flight engineers
Regular reporting