Thick Film

 ECRIM Thick film product ( Thick film substrate/Thick film resistor) capability
1. Overview

Passive network is fabricated on the same substrate by thick film process such as screen printing and sintering. The circuit design has great flexibility and short development cycle. It is suitable for mass production and has an annual output value of more than 100 million. In terms of electrical performance, it can withstand higher voltages, greater power and larger currents. We have foundry lines, complete processes such as film formation, assembly and packaging.

2. Product Features
Front and back metallization, can punch metallization, can realize chip bonding, device bonding and welding functions.

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Thin Film

Thin film describes a technology for the manufacture of a high-resolution circuit board based on a ceramic or other substrate. Due to its high degree of integration, thin film substrates form the basis of High Density Packages (HDP).

The structuring process is comparable to a traditional circuit board. The adhesive, resistor and metallization films are deposited onto the substrate surface using sputter techniques. This metallisation technology ensures an optimum adhesion of the films onto the substrate. In the subsequent photolithographic and etching processes, these films are structured according to the layout requirements. If necessary, an electroplating of the conductors is possible. Depending on the film thickness, minimum structure resolutions of 5 - 20 µm can be achieved. With the corresponding material and surface combinations, solderable and bondable surfaces can be produced. This enables the usage of the most varied of components up to a bare die assembly. The resistors produced in the thin film can be trimmed to a fixed value or according to a output signal of a hybrid circuit.

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HTCC (High Temperature Co-fired Ceramic), using high-melting-point metal heating resistor paste made of tungsten, molybdenum, molybdenum, manganese, is printed on 92~96% alumina cast ceramic according to the requirements of heat circuit design. On the green body, 4 to 8% of the sintering aid is then laminated, and co-fired at 1500 to 1600 ° C at a high temperature. Therefore, it has the advantages of corrosion resistance, high temperature resistance, long life, high efficiency and energy saving, uniform temperature, good thermal conductivity and fast thermal compensation, and is free from lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers, etc. Substance, in line with EU RoHS and other environmental requirements. Due to the high firing temperature, HTCC cannot use low-melting metal materials such as gold, silver, copper, etc., and must use refractory metal materials such as tungsten, molybdenum, manganese, etc. These materials have low conductivity and cause signal delay and other defects, so it is not suitable for A substrate for high speed or high frequency micro-assembled circuits. However, the HTCC substrate has the advantages of high structural strength, high thermal conductivity, good chemical stability, and high wiring density. HTCC ceramic heating sheet is a new type of high-efficiency environmental protection and energy-saving ceramic heating element. The products are widely used in daily life, industrial and agricultural technology, military, science, communication, medical, environmental protection, aerospace and many other fields.

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The LTCC (Low Temperature Co-Fired Ceramic) is a ceramic wiring carrier with a multi-layer structure. A flexible raw material (Green Tape) is used as a base. This unsintered film consists of a mixture of glass, ceramic and organic solvents. The firms Heraeus, DuPont and Ferro for example supply this raw material.

In the manufacturing of a LTCC Ceramic, a corresponding number of layers is started through the cutting of the Green Tapes. Prior to their further processing some materials require an additional Temper-Process at about 120 °C. As a second step the different layers are mechanically processed. This means that the adjustment and plated-through holes (Vias) are punched in the tapes. This is followed by a via-filling pressure and the application of the metallisations, resistors and the other films using a thick film-silk screen process. The usual conductive materials are gold, silver, platinum and palladium alloys. The injecting of the layers and the subsequent sintering at about 850 °C - 900 °C produce the finished multilayers. The sintering causes the LTCC material to shrink by about 12% in the x/y direction and 17% in the z-direction. It is particularly the shrinkage on the x/y-level that adversely affects any adherence to the structural precision. In order to prevent this, non-shrinkage material for the x/y-direction (0.1%) has been developed. This positive effect is achieved through a combination of specially developed tape materials. When deploying this material the increase of the shrinkage in the z-direction (about 45%), especially in the utilisation of holes and cut-out sections, must not be ignored. If this is observed in the construction and processing phases then the 0-shrinkage tape is a step forward in comparison to the traditional LTCC tape material.

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