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Hybrid Integrated Circuit HSFC28-461/HSFC28-461F TRANSIENT PROTECTION EMI FILTER Detail Specification

http://www.ecrimpower.com/uploadfile/downloads/32567-2014-(hsfc28-461)_ENG.pdf



The circuit adopts thick film hybrid integration process and surface assembly process, and is made of metal sealed shell.There is no bonding process in this circuit, so the examination content related to bonding process in the specification is deleted.


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