ECRIM has an advanced LTCC production line, using low temperature co-fired ceramic (LTCC) technology to provide customers with high-performance LTCC components, substrates, integrated package components to meet the needs of different customers. We can provide SIP packages for high-performance and high-density microwave devices. Our products are widely used in communication, microwave, automotive, radar and other electronic systems, as well as bluetooth, antenna modules, power amplifiers, filter components, duplexer switches and other applications.
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Design specification |
Standard(mm) |
Top(mm) |
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(A)Through hole diameter |
0.15, 0.20,0.25,0.30 |
0.10 (min) |
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(B)Through hole cover disk diameter |
>=Through hole + 0.05 |
Via + 0.03 |
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(C) Through hole pitch |
>=2.5 times through hole diameter |
0.20 (for0.10 Through hole) |
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(D) Distancefrom through hole to line edge |
>0.20 |
>0.15 |
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(E) Line width |
>= 0.15 |
>= 0.075 |
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(F) Line pitch |
>= 0.10 |
>= 0.08 |
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(G)Line center distance |
>= 0.25 |
>= 0.16 |
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(H) Distancefrom hole center to substrate edge |
>= 0.30 |
>= 0.25 |
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(I) Distance from line to substrate edge |
>= 0.20 |
>= 0.15 |
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(J)Distanceof inner layer tunnel substrate edge |
>= 0.15 |
>= 0.10 |
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(K)Distanceof through hole to ground |
0.25 |
>= 0.15 |
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Substrate thickness |
0.5 to2.0 |
0.4 to4.0 |
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Substrate layers |
20 |
40 |
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| Model |
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