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SIP package module
SIP package module

LTCC 3D SIP package module

  • Item NO.:

    LTCC 3D SIP package

  • Parameter 1:

    Three-dimensional vertical interconnection

  • Parameter 2 :

    Temperature (TC):-55℃～+125℃

  • Parameter 3:

    4 layers 2D-MCM laminates
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  • Product Detail
1. Three-dimensional vertical interconnection
2. BGA   I/O
3. 4 layers 2D-MCM laminates
4. Temperature (TC):-55℃～+125℃
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