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Power heat sink

  • Item NO.:

    Power heat sink
  • Parameter 1:

    Material: AlN/BeO
  • Parameter 2 :

    Accuracy: line width/line spacing accuracy ±5um
  • Parameter 3:

    Metalization: Ti, Cu, Ni, Pt, Au, prefabricated AuSn film, etc
  • Product Detail
Power heat sink
I. Overview
Using semiconductor thin film vacuum evaporation, sputtering, electroplating, photolithography, scribing and other processes, pattern photolithography, copper thickening, and prefabricated gold tin film preparation are performed on the surface of high thermal conductivity ceramic substrates to produce heat dissipation, electrical connection and other functions. The base substrate for high-power lasers.

2. Product features
High thermal conductivity, high precision

3. Technical indicators
 Material: AlN/BeO
 Accuracy: line width/line spacing accuracy ±5um;

 Metalization: Ti, Cu, Ni, Pt, Au, prefabricated AuSn film, etc.; meet the requirements of gold wire bonding, AuSn welding, conductive adhesive bonding.


4. Application areas

High-power lasers, semiconductor refrigerators, power circuits and other fields. (Can add application photos in PPT)


5. Typical product pictures


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Related products
Send A Message
Send A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

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